Specialists in PIC Packaging
Bay Photonics offer open access to our skills and services for Photonic Integrated Circuit (PIC) assembly and packaging. Our objective is to reduce our customer’s investment in direct costs for packaging design and assembly of proof of concept, prototypes, pre-production and production PICs.
Bay Photonics have deep engineering expertise in your business sector.
Our knowledge of packaging solutions will help our customers through their complete project life cycle from design, prototyping, new product introduction, test, volume manufacturing and transfer to low-cost volume manufacture, either onshore or offshore.
