Specialists in Photonic and Microelectronic Packaging
Bay Photonics offer open access to our skills and services for Photonic and Micro-electronic assembly and packaging. Our objective is to reduce our customer’s investment in direct costs for packaging design and assembly of proof of concept, prototypes, pre-production and production PICs
Bay Photonics have deep engineering expertise in your business sector.
Our knowledge of packaging solutions will help our customers through their complete project life cycle – design, prototyping, New Product Introduction, test, volume manufacturing and transfer to low-cost volume manufacture, either onshore of offshore.