Bay Photonics confirm hybrid PIC packaging capability

Bay Photonics confirm hybrid PIC packaging capability

Bay Photonics have been at the forefront of hybrid packaging for the past decade. During this time many of the problems we have seen focus on solving issues surrounding the integration of various components and technologies within low-SWAP packages.

With the advances in optical technologies, it is completely feasible to integrate many complex elements within the package. Items such as collimating lenses, spheres, fibre arrays, optical isolators, polarising optics, beam splitters and MEMS devices etc. can be found side-by-side. A more recent development is the integration of driver chips and micro-controllers for close-coupled connection to the PIC devices.

Also now requiring integration are various driver chips and we are seeing future requests for micro-controllers to be closely coupled with PIC devices and drivers.

As optical circuit data rates increase and become denser, there is a request for multiple RF connection capability. Currently up to 20 GHz, but future developments are likely to be up to 65 GHz and perhaps beyond. These technologies can be integrated onto single or multiple ceramic mounts, or across ceramic and standard composite PCBs, all contained and thermally-controlled within the package.

Dr Andrew Robertson – Manager of Innovation and Research commented “our prospective customers are always pushing the boundaries of what is possible. We continue to have deep discussion with them on what can be integrated and how they should develop their ideas. We would hope to be consulted at the PIC and sub-system layout stage, so we can best advise how to partition their project, optimising packaging cost”.

As with most PIC packaging requests, the customer usually requires a bespoke solution, to be designed at low cost, and often with a hermetic requirement.

Bay Photonics are pleased to be able to offer this service, for anything from academic/bench test prototypes from multi-project wafer (MPW) chips, through to production volume capabilities.”

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