Services & Capabilities

Bay Photonics offer a range of semiconductor / micro-electronic / photonic assembly processes to various different substrates / packages / modules.

What we do

Single/Multiple fibre optic assembly, alignment and test
Microelectronic integration with photonic IC
II-VI and III-V semiconductor assembly and packaging
CMOS Photonic IC assembly and packaging
Fibre Alignment kit build
Optical equipment build, commissioning, test

Services

Manual Die bonding
Manual and Auto Gold and Aluminium wire bonding
Various Optical alignment capabilities (including 6 axis auto align stage)
Auto/semi-auto die bonding and hermetic seam sealing capability
Gold ball bumping / re-bumping
Re-working of chips, wires and gold bumps

Business Services

Development review
Design for Manufacture (DFM)  Assembly & Test
New Product Introduction (NPI) Transfer to volume manufacturer
Process analysis
6 Sigma