Services & Capabilities

Bay Photonics offer a range of semiconductor / micro-electronic / photonic assembly processes to various different substrates / packages / modules.

Equipment

Cammax Precima EDB80 Die Bonder
Cammax Precima EDB65 Die Bonder
Hughes 2470 Palomar Automatic Wedge Wire Bonder
Palomar Technologies 3880 Die Bonder
ESEC 3100 Optima Auto Ball Bonder
Kulicke & Soffa 4124 Au Ball Bonder X2
Dage/Precima Industries MCT 15 Microtester Wirebond Pull Tester
XYZTEC Condor Sigma Bond Tester
Mitutoyo Quick Vision Apex  Measuring Instrument (0.1um resolution)
Orthodyne Electronics 3700plus Wedge Bonder
Fujikura FSM-100P Polarization Maintaining Fusion Splicer
Nikon Neoscope JCM-6000Plus Benchtop Scanning Electron Microscope
Henniker HPT-200 Vacuum Plasma Cleaning System
Binder Drying & Heating Chambers
Dry/Nitrogen Cabinets
Ultrasonic Baths
Novacure UV Spot Curing System
Gallenkamp Chambers
Helium Bomb chamber
Gross Leak Tester
Spectron Leak Detector

Workstations with open loop and closed loop piezo controlled stages for precision optical alignment X4

6 axis auto align stage
hermetic seam sealing capability
Manual Die wire bonding

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