Single/Multiple fibre optic assembly, alignment and test
Microelectronic integration with photonic IC
II-VI and III-V semiconductor assembly and packaging
CMOS Photonic IC assembly and packaging
Fibre Alignment kit build
Optical equipment build, commissioning, test
Manual Die bonding
Manual and Auto Gold and Aluminium wire bonding
Various Optical alignment capabilities (including 6 axis auto align stage)
Auto/semi-auto die bonding and hermetic seam sealing capability
Gold ball bumping / re-bumping
Re-working of chips, wires and gold bumps
Development review
Design for Manufacture (DFM)
Assembly & Test
New Product Introduction (NPI)
Transfer to volume manufacturer
Process analysis
6 Sigma