What we do
Single/Multiple/Ribbon fibre optic assembly, alignment and test
Microelectronic integration with photonic IC
II-VI and III-V semiconductor assembly and packaging
Silicon Photonic (SiP) semiconductor assembly and packaging
Fibre Alignment, kit build
Optical equipment build, commissioning, test
Services
Manual Die bonding
Manual and Auto Gold and Aluminium wire bonding
Various Optical alignment capabilities (including 6 axis auto align stage)
Auto/semi-auto die bonding and hermetic seam sealing capability
Gold ball bumping / re-bumping
Re-working of chips, wires and gold bumps
Business Services
Development review
Design for Manufacture (DFM), Assembly & Test
New Product Introduction (NPI) Transfer to volume manufacturer
Manufacturing Process analysis
6 Sigma analysis
Various Optical alignment capabilities
(including 6 axis auto align stage)
Auto/semi-auto die bonding and hermetic seam sealing capability
Manual Die & Wire bonding
Auto Gold and Aluminium wire bonding
Partners and members of
