Photonic Packaging Equipment
Equipping Innovation in Photonic Manufacturing
Equipping Innovation in Photonic Manufacturing
Behind every high-performing photonic device lies the precision of the equipment that built it.
At Bay Photonics, our cleanrooms are equipped with a comprehensive range of state-of-the-art automated tools for die bonding, wire bonding, plasma cleaning, microscopy, and optical alignment.
These systems are the backbone of our photonic packaging equipment suite — enabling us to deliver consistent, high-reliability processes across semiconductor photonic and microelectronic assemblies. From concept to production, our tools ensure precision, stability, and performance at every step.
How to Start your Photonic Project with Bay Photonics
What services do you need?
From die bonding to fibre alignment, we’ll help identify the right process and equipment for your application.
You’ll receive expert guidance on the best assembly and packaging approach for your device.
Design & Development
We work with you to match your requirements with the right tools, materials, and processes, ensuring efficiency and repeatability from prototype to volume manufacturing.
Delivering our services
Your components are built and tested using our advanced photonic packaging equipment.
You’ll receive high-reliability assemblies, manufactured to exacting standards and ready for integration into your system.
Die Bonding
Our die bonding suite supports both prototype and high-volume manufacturing – combining flexibility with precision.
Key Equipment
These systems allow us to handle a wide range of materials and geometries – guaranteeing repeatable, void-free, high-strength bonds every time.
- Semi-Automatic Die Bonding (Solder & Epoxy): Cammax EDB80, EDB65
- Fully Automatic Die Bonding (Solder & Epoxy): Palomar 3880
- Fully Automatic Die Bonding (Solder & Epoxy): Amadyne Fab 1
- ATV SRO-700 Vacuum Solder Reflow Oven - delivers void-free solder joints for reliability
- Bond Test Equipment: XYZTEC Condor Sigma Bond Tester
Wire Bonding
Our wire bonding stations offer both versatility and throughput, supporting gold and aluminium bonding for a wide range of package types.
Key Equipment
These platforms provide fine control of bond parameters — force, time, ultrasonic energy, and loop profile — enabling precision connections even in thermally sensitive or compact devices.
- F&S Deep-Access Ball & Wedge Bonder
- Palomar 9000 Auto Wedge Bonder
- Palomar 8000 Auto Ball Bonder
- ESEC 3100 Ultima Auto Ball Bonder
- K&S Semi-Auto Gold Ball Bonders
Clean & Test
Maintaining surface integrity and cleanliness is critical to optical performance.
Key Equipment
This ensures all components meet strict cleanliness and adhesion standards before and after bonding, improving reliability and long-term performance.
- Henniker HPT-200 Vacuum Plasma Cleaning System
- Dage/Precima 2400 Wirebond Microtester
Fibre Optic Assembly
We use advanced fibre preparation and splicing systems to achieve precision optical connections.
Key Equipment
This full suite guarantees clean, low-loss fibre terminations for consistent optical alignment and coupling efficiency.
- Thermal Stripper: Fujikura RS02/03
- Cleaver: Fujikura CT101
- Ultrasonic Cleaner: Fujikura USC-03
- Fusion Splicer: Fujikura FSM 100P
- Re-coater: Fujikura FSR-05
Hermetic Sealing
Protecting sensitive photonic components is essential for performance and lifetime.
Our hermetic sealing equipment delivers precision welding, temperature control, and atmospheric management.
Key Equipment
These systems enable us to achieve true hermeticity – providing proven protection for defence, space, and telecom environments.
- Induction Heater – Fibre & Array Sealing
- Seam Sealer: Pyramid HPS10-19 – parallel-gap seam welding for microelectronic & photonic packages
- Projection Welder: Accelonix/Amada – opposed electrode welding for circular packages (TO39, TO46, TO8, TO66)
- Leak Test Systems: Gross Leak, Helium Bomb & Spectron Fine Leak Tester
- Laser Marker – for traceable, precision component marking
Bring Precision to your Photonic Assembly
Let’s work together to make your next photonic device reliable, robust, and production-ready.