About Bay Photonics

Shaping the Future of Photonics - The Bay Photonics Way

Who are we

Where precision meets passion.

Founded in 2007, Bay Photonics is a UK-based specialist in photonics assembly and packaging for semiconductor photonic devices.

Located within EPIC – the Electronics and Photonics Innovation Centre in Paignton, we’re part of a region with deep roots in optical communications and advanced component manufacturing.

Bay Photonics holds ISO 9001:2015 certification and is currently working towards ISO 14001 certification. Our purpose-built facility includes a Class 10,000 / 1,000 cleanroom (ISO Class 7 / 6), along with state-of-the-art welding, sealing, wire bonding, and pick-and-place equipment.

We combine decades of experience with a commitment to innovation, helping our partners bring next-generation photonic technologies to market with precision and confidence.

What we do

Behind every precision-engineered package and every photonic breakthrough is a dedicated team bringing decades of knowledge, creativity, and care to the work we do.

Our team combines precision engineering with an agile, collaborative approach to bring next-generation photonic technologies to market.

We specialise in:

Packaging for plastics and ceramic leadless packages
Hermetic butterfly packages
TO cans

And we integrate:

Thermal control
Electronics
Fibre and free-space optics…with Photonic Integrated Circuits (PICs) for complete, high-performance solutions.

For specialised requirements, we design and develop hybrid packages tailored to unique customer needs, delivering reliable, production-ready results.

Bay Photonics - Our Approach

Our Vision

We are with you from day one, working closely through every stage of development to turn your idea into reality and your product into success.

When you partner with us, you gain access to proven experience and reliable engineering know-how.

Our Expertise

Our technical team brings decades of experience from world-leading opto-electronic component manufacturers.

Using deep technical knowledge and cutting-edge equipment, we solve complex packaging challenges across a wide range of photonic applications, helping you scale efficiently and move confidently into high-volume production.

Our Commitment

We understand that every project is unique. That’s why we design packaging solutions tailored to your exact needs.

This approach reduces development risk, accelerates time to market, and lowers total project cost, ensuring your innovation succeeds.

Our Story

Bay Photonics was founded by Glenn George and Larry Clarke, who shared a clear vision:

“To help partners stay ahead by providing reliable, carefully engineered packaging solutions for Photonic Integrated Circuits (PICs), regardless of the semiconductor technology behind them.”

Over time, our team discovered that the greatest opportunity in photonics lies in tailored packaging – built specifically for each customer’s application.

There’s no “one-size-fits-all” in photonics… and that’s where we excel.

Our Values

At Bay Photonics, we’re more than an OSAT provider – we’re your agile partner in bringing next-generation photonics-based semiconductor solutions to life.

Our values define how we work and why we care:

Precision – Delivering high-quality, accurate engineering in every package.
Integrity – Building trust through transparency and long-term partnership.
Innovation – Constantly improving our processes and solutions.
Collaboration – Working closely with customers, research institutions, and industry to achieve shared success.

From AI-driven data centres and quantum computing to IoT, LIDAR systems, and ultrafast optical transceivers, we operate at the forefront of advanced photonic integration.

Our mission is to help innovators move from concept to functional prototype – with unmatched speed, precision, and confidence.

Because the future depends on light… and at Bay Photonics, precision is how we bring it to life.

Certification

Bay Photonics operates a Quality Management System which complies with the requirements of ISO 9001:2015 for the following: Provision of PIC packaging for proof of concept, prototyping and production, using semiconductor and laser/led assembly for design, development, design for manufacture (DFM), production method and test (DFT). Design consultancy and bespoke assembly/packaging services for customers.

From AI-driven data centres and quantum computing to IoT, LIDAR systems, and ultrafast optical transceivers, we operate at the forefront of advanced photonic integration.